• Most significant machine model for 300mm wafers
  High precision, high rigidity, high throughput machine.
• Better cost performance for 300mm wafers.
• 300mm Framed wafer & CSP handling machine.
• It is the prober with high-speed probing that targets non-memory device.
• Most significant machine model for 200mm wafers
  High precision, high rigidity machine.
• Highly efficient, High throughput, wafer & CSP handling machine.
  Better cost performance machine.
• High-speed machine for discrete.
• 200mm Framed wafer & CSP handling machine
• Accretech Probing Machine for full wafer testing on a single touch down. Developed with capability to simultaneously measure on 12 stages with dedicate XY stage and POGO tower.
• Consolidated management of the operation of probing machines for higher operation rate.
• This network allows you to consolidate the management of resources with the user host.
• The GEM Network System supports standards based on the SEMI standards to achieve factory automation at customers.
• This is a group of dedicated terminals for increasing the efficiency of test areas.

The following tools are currently being used:

A wafer prober is a system used for electrical testing of wafers in the semiconductor development and manufacturing process. In an electrical test, test signals from a measuring instrument or tester are transmitted to individual devices on a wafer via probe needles or a probe card and the signals are then returned from the device. Ft02000-r011-e0 8-09-99 fully automatic prober uf190/uf200 device creation guide tokyo seimitsu co., ltd. It is the prober with high-speed probing that targets non-memory device. Probing Machine: UF2000 Most significant machine model for 200mm wafers High precision, high rigidity machine.

Facilities for Functional Test on Integrated Circuits

288 digital channels (256 providing up to 800Mb/s datarate, 32 providing up to 1.6Gb/s)
4.1GS arbitrary waveform generator
320MS/1GHz digitizer
1x 8 channel device power supply (max 4A/channel)
2x 4 channel device power supply (max 8A/channel)
Additional software for memory test and scan test analysis
Supports manual package test and automatic wafer test (using the UF200 wafer prober)

Uf200 Prober Manual Download

Accretech UF200 wafer prober

Fully automatic wafer prober for up to 25 wafers/lot
Supports 6inch and 8inch wafers
Temperature controlled chuck, -40°C up to +125°C

256 digital channels (up to 125MHz)
4-channel Agilent power analyser
1 system configured for package test, the other system configured for wafer test

Accretech UF200A wafer prober

Standard chuck (not temperature controlled)

Spectral range 7.5 .. 14µm
Temperature measurement range -40°C .. 1200°C
Image size 640x480

Standard lens 1.0/30 mm

image area (30 x 23)°,

minimum distance 300mm

Microscope objective 1,0x

image (16 x 12) mm²,

Uf200 Prober Manual Transmission

distance 50 mm, resolution 25µm
Online: up to 10 points
Offline: temperature of each pixel can be determined, additionally regions with min/max evaluation can be defined
Usage: e.g. detection of hot spots on chips (caused by shorts), thermal check of PCBs, etc